The A3940KLP and A3940KLW are designed specifically for automotive applications that require high-power motors. Each provides four high-current gate drive outputs capable of driving a wide range of n-channel power MOSFETs in a full-bridge configuration.
Bootstrap capacitors are utilized to provide the above-battery supply voltage required for n-channel FETs. An internal charge pump for the high side allows for dc (100% duty cycle) operation of the bridge.
Protection features include supply under/overvoltage, thermal shutdown, and motor lead short-to-battery and short-to-ground fault notification, and a programmable dead-time adjustment for crossconduction prevention.
The overvoltage trip point is user adjustable. The A3940 is supplied in a choice of two power packages, a 28-pin TSSOP with an exposed thermal pad (package type LP), and a 28-pin wide-body SOIC (package type LW). Both package types are available in lead (Pb) free versions, with 100 % matte-tin leadframe plating (suffix T).
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·Drives wide range of n-channel MOSFETs·Charge pump to boost gate drive at low-battery-input conditions·Bootstrapped gate drive with charge pump for 100% duty cycle·Synchronous rectification·Fault diagnostic output·Adjustable dead-time cross-conduction protection·Motor lead short-to-battery and short-to-ground protection·Undervoltage/overvoltage protection·-40°C to +150°C, TJ operation·Thermal shutdown
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Load Supply Voltage Range, VBB,
VDRAIN, CP1 ............. -0.6 V to +40 V
Output Voltage Ranges,
LSS.............................. -2 V to +6.5 V
GHA/GHB, VGHX ............ -2 V to +55 V
SA/SB, VSX ................... -2 V to +45 V
GLA/GLB, VGLX............... -2 V to +16 V
CA/CB, VCX ................ -0.6 V to +55 V
CP2,VCP, VIN ............. -0.6 V to +52 V
Logic Input/Output Voltage Range
VIN, VOUT ................. -0.3 V to +6.5 V
Operating Temperature Range,
TA ........................ -40°C to +135°C
Junction Temperature, TJ .... +150°C*
Storage Temperature Range,
TS ........................ -55°C to +150°C
* Fault conditions that produce excessive junction temperature will activate device thermal shutdown circuitry. These conditions can be tolerated, but should be avoided.
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